Miniature universal contact from ITT Interconnect Solutions

As miniaturization continues to drives the size of handheld devices down, the need for miniature interconnects that incorporate reliable and robust designs is critical. Equally important, the market is challenged by the need for aggressive component pricing due to its competitive nature.

UC is a small form factor, stamped contact that is suitable for solderless component interconnection where miniaturization, reliability and flexibility are prerequisites. A unique pre-loading and anti-lift design feature maximizes contact force to ensure consistent and dependable contact integrity. The ability of the contact to move in the X-Y-Z directions also plays a key role in providing a robust connection. The contact can be mated and de-mated up to 3000 times, making it suitable for every-day utilization.

The use of a stamped process and innovative design ensure a price competitive solution for a wide range of applications, including handset and wireless handheld devices, PC card products, home electronics devices, medical products, and automotive telematics systems.

Compliant with WEEE and RoHS directives, the UC is available in a variety of contact heights ranging from 1.3 mm 4.0 mm free height. Compressed heights as low as 0.9 mm are available. “Side wings” protect the active parts of the contact and prevent the contact from overstressing, while domed contact points allow good hertz stress and deliver low contact resistance. UC aids designers by minimizing qualification time and providing a standard interface across applications and platforms, as well as freedom of board positioning.