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Mill-Max Receptacles and Pass Through Sockets With Organic Fibre Plug Solder Barrier

12th January 2010

ES Admin

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Datasheet

Mill-Max’s knock-out-bottom receptacles are discrete sockets for soldering into printed circuit boards. Twelve sizes are now available; ten have carrier tape as standard packaging. Tape packaging is becoming increasingly popular since it permits through-hole components to be placed simultaneously with surface mount parts on pick-’n-place assembly lines. The knock-out-bottom feature enables these sockets to be made short enough to stand upright in a carrier tape pocket. The OFP barrier then permits the sockets to be vacuum picked from the tape prior to placement in a hole in the circuit board.

FEATURES:

• Designed for hand, wave or reflow* soldering. The organic fibre plug barrier prevents solder, paste or flux from contaminating the spring contact.

• After soldering, the OFP barrier is knocked out of the receptacle when the device is plugged in.

• The through-hole receptacle design permits the component lead to pass through and make connection with another circuit board.

• All Mill-Max receptacles use a precision-machined brass housing with a press-fit beryllium copper “multi-finger” contact (heat-treated BeCu is the best electrical spring contact material.)

• All parts are available as discrete receptacles; #0479, #0577, #3966, #4015, #4280, #5280, #5291, #5359, #5364 & #9873 can also be supplied on carrier tape per EIA-481 for industry standard pick and place machines.

Learn more about our OFP Receptacles and Pass Through Sockets at www.mill-max.com/PR565