Micro SFP+ frees up 19% more faceplate space

10th March 2015

Siobhan O'Gorman

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A micro SFP+ connector and cable assembly, which reduces space requirements on faceplates and PCBs in telecomms, data communications, networking and medical diagnostic equipment, has been released by TE Connectivity. The connector and cable assembly is up to 50% smaller in width and length than current SFP+ interconnects, enabling denser equipment designs.

The micro SFP+ connector and cable assembly supports up to 10Gb/s data transmission and 10 Gigabit Ethernet, Gigabit Ethernet, Fibre Channel, InfiniBand and Fibre Channel over Ethernet (FCoE) protocols.

Requiring as little as 15mm board space, the connector and cable assembly frees up 19% more faceplate space than a SFP+ connector, increasing faceplate density. The SFP+ connector and cable assembly were designed with a staggered contact configuration, which improves signal routing. Additionally, the bottom and top contacts have been further optimised for speed.

EMI is minimised through a diecast housing, cable shield crimped at 360 degrees and an extended EMI shield over the cable’s plug. For manufacturing automation, the board interconnect combines the connector and cage into one finished product for automated board placement. High temperature pin-in-paste soldering can be achieved as the product withstands up to 265°C.

“Our micro SFP+ connector and cable assembly is suitable for communications equipment designs where space is at a premium,” said Roel van Lokven, Product Manager, Cable and Cable Assemblies, TE Data Communications. “This is the latest in a series of TE connector innovations that enables denser designs, higher performance and more cost-effective manufacturing.”