Low-profile connectors enable speeds up to 25Gb/s

Accomodating PCB thicknesses of 1.57-3.18mm, the EdgeLine High-Speed Edge Card connectors are suited for intricate product designs. They are available in multiple circuit sizes, enabling greater design flexibility for signal and power assignments. With the CoPlanar variants measuring 6.40mm above the PCB and the CoEdge variants measuring 3.50mm above and below the PCB, the connectors offer low-profile heights for enhanced airflow and thermal management.

The connectors feature a press-fit compliant-pin terminal design, which enables easy board termination using flat-rock tooling and SMT attach for higher speed capability, and cost-effective stitched terminals to accommodate a variety of signal and power requirements. The 0.80mm pitch CoEdge connectors offer keying and locking features to secure it to the PCB and improve board alignment during mating. Additionally, a secondary locking option helps prevent accidental unmating and the PCB from backing out of the connector. Flexibility for power, slow-speed, single-ended signals and high-speed differential circuits is offered by common or singulated ground. The EdgeLine High-Speed Edge Card connectors also feature a centre key on certain circuit sizes to improve the PCB alignment during mating. This is achieved by centring the mating edge within the socket interface.

Adam Stanczak, Product Development Manager, Molex, commented: “As systems become more complex, customers not only require higher data rates and superior signal transmission clarity, but also greater levels of interconnectivity within limited board space. The latest EdgeLine connectors address the need for a reliable, high-speed, one-piece solution while continuing to provide the ultimate in design flexibility with compact density and minimal PCB footprint real estate.”

Along with other EdgeLine products, Molex will feature the EdgeLine High-Speed Edge Card connectors in booth 117 at DesignCon 2014, January 29 – 30, Santa Clara, California, USA.