TE Connectivity Develops LGA 2011 Socket For Intel Corporation’s Core I7 And Xeon 5 CPU Processors

The contacts of TE’s LGA 2011 socket have solder balls for surface mounting onto the printed circuit board (PCB). The product’s hex ball array provides a stronger housing and minimizes the space that the 2011 balls take.

The socket boasts an integrated lever mechanism (ILM) that generates the Z-axis compression load and its robust bolster plate limits PCB bowing during compression. The product is available in either 15u’’ or 30u’’ gold contact plating, which enhances product performance. TE provides a complete socket and hardware system, while ILM and backer plate must be ordered separately.