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ITT Interconnect Solutions launches Universal Contact for angular alignment applications

18th January 2010

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ITT Interconnect Solutions has launched a Universal Contact for angular alignment applications which provides a vertical electrical connection between a device and a PCB. Additionally, it offers the advantage of allowing angular mating within the same footprint as a standard UC. ITT Interconnect Solutions produced this new and innovative UC within a very tight timeframe of four weeks from design through to production, enabling their first end customer to produce 2.5 million handheld units within 60 days.

The ITT UC for angular alignment applications has a sloped front beam which enables a mating angle of 90 degrees and still retains the same overall dimensions as a standard UC. Features include 2.5mm free height with 1.0mm of deflection and X-Y-X movement with the mating device. A solder well prevents wicking of flux solder into the critical beam area and side wings prevent beam overstress. Further features include a domed contact for high hertz forces and 0.3N of pre-load force minimum. The pitch between contacts is 1.35mm.

Electrical specifications include a voltage rating of up to 500VDC.

Applications include handsets, where the new contacts can be used for solderless component and I/O interconnects as well as battery and antenna contacts. Further applications include memory sticks, GPS board to screen interconnects, CT scanning equipment, key fobs and smoke detectors.