ITT Interconnect Solutions introduces two new snap-on and ultrasonic PCMCIA I/O kits

In accordance with its quest to provide expertise and leading-edge capabilities to design engineers, ITT ICS has now developed two new PCMCIA I/O kits - snap-on and ultrasonic - each available with a range of options and customisable features for maximum design flexibility.

The company’s new snap-fit PCMCIA kit consists of a pair of robust mechanically-assembled stainless steel card covers which provide the PC card with both torsional stiffness and excellent drop test performance. The ultrasonic kit welds the plastic cover set around the PC card ultrasonically to create a solid protective shell. Both the snap fit kit and the ultrasonic kits are secure and tamper-proof. Further features common to both kits are standard card end closure mouldings and the ability to accommodate specialised end caps or extension box designs. The robust 68-pin connector can withstand more than 10,000 mating cycles and to suit the widest possible range of uses, multiple connector off-set options are available. Kits can be supplied with or without cardbus features. High-volume production tooling is available on request.

Both ITT ICS’ PCMCIA I/O kits meet all Type I and Type II specifications, as well as providing optimum EMI shielding. They meet PCMCIA and JEIDA standards and are fully RoHS compliant. Further applications include: security devices, test and measurement instruments, hand-held portable devices and medical instruments.