Interconnects deliver high-current carrying capacity

Dense electronic packaging often requires designs where subassemblies are mated without visual guidance.

These interconnects provide engineers with high-current carrying capacity and accurate mating in hard-to-reach and visually obscured applications like data centre power transmission systems, base stations, battery management inverters and electric vehicle charging stations.

The connectors incorporate Molex’s COEUR socket technology, where panel-mounted receptacle housing’s guideposts align with the inner surfaces of the header sidewalls, before contacts and pins engage, to facilitate trouble-free blind mating.

These conical sockets also offer low contact resistance and low voltage drop, creating minimal heat generation at the contact interface, resulting in higher current-carrying capacity compared to other contact designs.

Additionally, PowerWize headers and receptacles are designed to meet industry-standard, safe-to-touch requirements.

The Interconnects offer screw-mount pins attached to printed circuit boards or busbars with solder tail pins to enhance manufacturing flexibility in three different sizes: 3.40 mm (75.0 A), 6.00 mm (110.0 A) and 8.00 mm (175.0 A).

Cable assemblies feature ±2.00 mm of radial self-alignment to mitigate stack-up tolerance issues.

At the same time, the reflow-capable/wave solder-capable solder tail headers are suitable for either pin-in-paste reflow PCB processing or wave solder PCB processing. PowerWize BMI crimp machined contacts offer a wide range and will accept 1/0, 2, 4, 6, 8, or 10 AWG wires.