Interconnection system overcomes harsh environments
The ARISO Contactless Connectivity platform from TE Connectivity is a hybrid interconnection system that reliably delivers power, data and signal over short distances, even in harsh environment applications. It is in stock at Farnell element 14. This platform helps overcome traditional connector restrictions and design constraints because no mechanical contact is required, enabling connectivity where connections were not possible before.
In factory environments, dust, dirt, water, corrosion and vibration can threaten connections that are crucial to maximising uptime and productivity. TE’s ARISO Contactless Connectivity overcomes those design restrictions, while making maintenance and installation easier due to a high degree of design flexibility.
The platform provides a small form factor and features such as over temperature, reverse polarity and foreign object protection. It is easy to use and offers all the benefits of a non-mechanical contact point.
Additional features include: rotational freedom, no wear and tear, reduced maintenance, unlimited mating cycles, vibration resistance, inductive magnetic coupling providing reliable connections and connection on the fly
TE’s ARISO Contactless Connectivity platform can be used in a variety of applications including printing drums, milling machines, injection molding, centrifuges, wafer production, rotary tables and robotic tool changers.
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