I/O interconnects address data centre challenges

The microQSFP interconnects deliver QSFP28 functionality in a smaller form factor, while providing higher density and performance at 28 and 56 gigabits per second (Gbps).

The pluggable I/O single high (1xN) cages and surface mount connectors, forged from traditional stainless steel and copper alloy, feature an integrated heatsink in module that offers significantly better thermal capability than current pluggable solutions, which can help reduce energy costs.

Improved electrical performance at 25 Gbps, provides 33 percent higher density over existing QSFP connectors, and can fit up to 72 ports on a standard line card.

The 4 × 28 Gbps solutions support next-generation designs with a smaller, standardized form factor and 25 Gbps NRZ/56 Gbps PAM-4 performance with backwards compatibility to 28 Gbps.

TE’s microQSFP has also been adopted as a Media Dependent Interface (MDI) for the IEEE P802.3cd 50 Gbps project as supporting 50 Gbps (1 × 56 Gbps ), 100 Gbps (2 × 56 Gbps), and 200 Gbps (4 × 56 Gbps) interfaces.

Space-saving 14.25 mm port-to-port pitch and durability up to 1,000 cycles is a feature.

Typical data communication applications for the microQSFP interconnect solution include networking switches, routers, servers, networking interface cards and optical transport equipment.