Flexible circuit assemblies suit data transmission

Molex is one of the first manufacturers to incorporate DuPont Pyralux TK flexible circuit material into the volume production of multi-layer flexible circuit constructions. Pyralux TK is a double-sided flexible copper clad laminate and bonding film system formulated with DuPont Teflon fluoropolymer film and DuPont Kapton polyimide film. It provides exceptional electrical performance for high speed digital and high frequency flexible circuit applications.

The dielectric constant and low-loss capabilities of Pyralux TK deliver a mechanically flexible construction, tighter bend radii and faster transmission than standard flexible assemblies.  Molex High-Speed Low-Loss Flex Circuit Assemblies are available with self-coiling or mechanically-assisted coiling, offering options for flexible three dimensional packaging, minimising insertion loss and providing improved airflow compared to a standard PCB design.

“Routing signals within densely packaged datacomms, telecommunications, aerospace and defence equipment can be challenging,” said Greg Kuchuris, Marketing Manager, Molex. “As surging data transmission demands push system speeds higher, advanced materials become more critical. Our High-Speed Low-Loss Flex Circuit Assemblies utilise leading-edge technologies from DuPont Circuit & Packaging Materials and Molex to bring customers a unique high-performance solution, with superior signal integrity in digital and high frequency flexible circuit applications.”

“Molex and DuPont have collaborated closely to integrate Pyralux TK into the volume production of the Molex High-Speed Low-Loss Flexible Circuit Assemblies, with exceptional results,” added Prasanna Srinivasan, Market Development Leader, Circuit & Packaging Materials, DuPont. “Signal loss can be minimised, which allows increased speeds and design flexibility.”