Molex Introduces Next-Generation, High-Performance Memory Module Sockets

An established DDR (Double Data Rate) DRAM interface technology, DDR3 supports data rates of 800 to 1600 Mbps with clock frequencies of 400 to 800 MHz (respectively). With a standard operating voltage of 1.5V, DDR3 cuts power consumption by 30 per cent in comparison to its DDR2 predecessor, while effectively double the speed.



“As the need for higher bandwidths continues to grow, the ability to transfer data at faster rates without sacrificing valuable real-estate or power is critical,” says Douglas Jones, product manager, Molex. “With DDR3 DIMM sockets, our customers can take advantage of the ultimate high-performance memory interconnect, while maintaining or reducing existing packaging sizes and lowering power consumption.”



Molex’s ultra-low-profile DDR3 DIMM sockets for through-hole mounting feature a lower (1.10 mm) seating plane than standard designs, enabling the use of very low-profile modules with maximum seating heights below 2.80 mm in ATCA* blade systems. It also frees up to 20.23 mm of vertical space above the PCB for the mounting of high-density DIMMs, while maintaining the same design height. The new DDR3 DIMM sockets also feature a low-level contact resistance of 10 milliohms, to support the use of registered DIMM modules (in addition to unregistered DIMMs) and reduce power consumption in blade servers. The halogen-free sockets have a glass-filled, high-temperature nylon housing and latches to enable wave soldering and high-temperature infrared reflow operations.



Designed for multi-processor server chipset applications, the Molex aerodynamic DDR3 DIMM sockets, for press-fit and SMT mounting, feature a stream-lined housing to help maximise airflow as well as space and cost savings, while lowering power consumption. The sockets are available in very low profile press-fit (14.26 mm), low profile press-fit (22.03 mm), low profile SMT (21.34 mm) and very low profile SMT (14.20 mm) heights. The ergonomic latch design enables quick actuation and easy removal of high-density memory modules, while the low 2.40 mm seating plane optimises vertical space for more flexible socket module design heights. Freeing up valuable PCB real-estate for higher-density trace routing, the press-fit sockets feature smaller eye-of-needle compliant pins than standard press-fit terminals.



All Molex low-profile, very-low-profile and ultra-low-profile DDR3 DIMM sockets are RoHS compliant and the through-hole and SMT versions are halogen-free. For more information, please visit www.molex.com/link/ddr3.html. To receive information on other Molex products and industry solutions, please sign up for our e-nouncement newsletter at www.molex.com/link/register/.