Connectors line extended with reduced board stack height

20th December 2016

Lanna Deamer

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Datasheet

Extending its line of Mezza-pede SMT connectors, Advanced Interconnections has reduced board stack height by 15% with a lower profile header (model DHAL). The innovative design features a thin insulator, at 0.025" (0.63mm) – half the thickness of the original header design.

When the product is paired with mating socket model DHS, a z-axis stack height of 0.132" (3.4mm) is achievable. This Mezza-pede connector facilitates a reduction in package height and a shorter signal path in applications ranging from tunable laser power connectors in optical transceivers to hand-held medical electronic devices.

Mezza-pede SMT Connectors are suitable for 1.0" pitch board-to-board and cable-to-board interconnections in high density electronic designs, where space is at a premium. The new model DHAL is currently available with 14 positions and features Advanced’s proprietary SMT lead frame and pin design, combining high reliability screw-machined terminals with an over-moulded lead frame in a precision-moulded LCP insulator.

Typical applications include telecommunications, military, medical, and anywhere a high reliability surface mount connector is needed in a high density package. Mezza-pede SMT Connectors with 30 microinches (µin) gold plating pass the 20-day mixed flowing gas (MFG) test, often required by the world’s most demanding telecommunications applications. The Mezza-pede connector line, including the new model DHAL, is RoHS compliant, usable at operating temperatures from -55 to +125°C, and can handle as much as 1.1A current at +80°C.