Connector system delivers 40Gbps for telecomms

Molex has claimed that the connector system delivers industry-leading low cross-talk and high density performance for next-generation backplane interconnect solutions. Suited for telecommunications and data networking applications, it meets conventional, co-planar, orthogonal midplane and orthogonal direct requirements.

Offering 2-6 pair options to support varying price and performance demands, the conventional connector orientation features a right angle daughtercard mating to a vertical header. The 1.90mm conventional solution supports 80 differential pairs per linear inch, while the 3.00mm conventional solution enables quad-route capabilities and a lower PCB layer count. The Impel backplane connector solutions for orthogonal architectures allow for 3-6 pair configurations, offering 18-72 differential pairs per node.

The Impel connector system also provides direct connection of PCBs in an orthogonal orientation. This shortens system channel lengths, improves signal integrity channel performance, supports open air-flow design and reduces applied cost.

Zach Bradford, New Product Development Manager, Molex, comments: “With many of our customers designing new multi-generation system architectures that include multiple data rate increases over time, our goal was to develop a highly flexible, high-performance connector solution. The Impel connector system provides the footprint and interface that allows users to migrate more easily and cost effectively to faster data rates without having to completely redesign their architecture or replace existing data centre hardware.”

Available for free on the Molex website, users identify backplane parameters via a series of inputs in the Backplane Pin Map Configurator. This then quickly generates a pin map for their backplane application, shorting time-to-market and improving overall backplane design and performance.