Connector range operates at -55°C to 125°C

This is a lighter aluminium hermetic interconnect range suitable for aerospace, military, space, and motorsport applications.

These high-performance connectors are engineered for demanding environments where every gramme counts. The MLTV series achieves a weight saving of up to 30% compared to traditional stainless steel connectors, a crucial advantage in weight-sensitive applications. This reduction is achieved without compromising performance, thanks to Amphenol Martec’s proprietary glass-to-metal sealing technology, which ensures the integrity of the connection even in harsh conditions.

The MLTV connectors are designed to industry-standard planforms for ease of mating and feature proprietary pin and socket contact receptacles derived from MIL-DTL-38999 Series III.

They are available in both box mount and bulkhead mount configurations, and offer an operating temperature range of -55°C to 125°C. The hermetically sealed receptacle provides complete component protection, ensuring reliable performance in challenging environments.

“The MLTV series addresses a key challenge in industries where the aggregate weight of components can impact performance,” says Peter Sullivan, Technical BDM Interconnect Solutions at Astute Group. “These connectors combine lightweight design with robust performance and hermetic sealing, making them well-suited for aerospace, motorsport, and other demanding applications.”

Amphenol Martec is a leading designer and manufacturer of hermetic interconnect solutions for mission-critical applications. Their products are engineered to withstand extreme environments, including high pressures, high temperatures, and harsh conditions.

They offer a wide range of hermetic connectors, including circular, rectangular, and D-subminiature connectors, as well as custom solutions tailored to specific application requirements.

As a centre of excellence within the Amphenol Corporation, Martec leverages its extensive experience with exotic materials and advanced manufacturing processes to deliver high-performance interconnect solutions that meet the stringent demands of critical applications.