Connector delivers twice the current-carrying capacity

With a space-saving design that offers a stacking height of only 0.7mm and a depth of 2.6mm, the low-profile BM25 series delivers twice as much current-carrying capacity in a smaller profile than traditional technologies. Offering contact resistance as low as 5mΩ or below for power contacts and 30mΩ or below for signal contacts, the BM25 series provides significant power savings by utilising a design that minimises contact resistance.

A six point, highly reliable clip-like contact structure combined with a robust eight-point metal lock provides a mating force that is resistant to intense vibration and drop impact. The BM25 series also utilises a metal guide structure that prevents housing damage due to incorrect mating. With a breaking strength of 70N, the metal guide design ensures that if the header and the receptacle should be mated incorrectly, the metal hold-downs would dissipate the force and prevent housing damage.

Offering simple and easy mating operation, the BM25 series utilises guide ribs that self-align up to 0.48mm in the pitch direction and 0.46mm in the width direction.

"Our ultra-compact BM25 series hybrid board-to-FPC connector delivers more power in a smaller package than competing technologies on the market," said Rick van Weezel, Vice-President of Sales and Marketing for Hirose Electric USA. "Designed for mobile device connectivity, the BM25 series connector meets the power and signal transition needs for a wide variety of handheld consumer, medical, point of sale, inventory control, and other wireless equipment."

The BM25 series has an integrally molded header and receptacle that prevents solder wicking. This space saving connector is suitable for vacuum pick & place equipment. The BM25 series connector has a rated voltage of 30 V AC/DC, a power contact resistance of 5mΩ maximum and a signal contact resistance of 30mΩ maximum, an insulation resistance of 1000MΩ minimum, and an operating temperature of -40 to +85ºC.