Fine Pitch Bump Adapters Allow BGA Devices of Any Pitch to be Used with 0.40mm Pitch Boards

The adapter tops have landing pads that can be designed to accept any device on any pitch and easily settle into fine pitch footprints including Thin-Shrink Small Outline Packages (TSSOP) and Quad Flat Packages (QFP) with pitches down to 0.40mm. In addition, the adapter bottom has raised connection pads up to 0.010 (0.25mm) that provide easy mounting of the adapter to the target board.

Due to the open space now available on the top of the adapter board, manufacturers can easily add components to the design at a minimal cost. Fine Pitch Bump Adapters save users money by integrating higher pitch BGA devices with boards laid out with smaller pitches that typically could not be used together.

Fine Pitch Bump Adapter boards are 0.062 (1.57mm) thick FR4 or Rogers 370HR, with 1oz. copper traces on both sides. The non-solder mask defined (NSMD) pads are finished with electroless nickel immersion gold (ENIG). The apparatus can operate up to 221°F (105°C) for FR4 and 266°F (130°C) for lead-free.

The new adapters are available in tape and reel for high-speed SMT assembly and can be manufactured for RoHS compliance. Standard line and trace spacing down to 0.003 (0.076mm) can be used.

Fine Pitch Bump Adapters are available in panelized form, as an adapter only, or as a turnkey solution with devices mounted. Aries specializes in custom design and production. In addition to standard products, special materials, platings, sizes, and configurations can be furnished depending on quantity. For more information regarding an adapter to meet special needs, consult the Aries factory.

Pricing for the Fine Pitch Bump Adapters for a typical application starts at $15 per adapter in quantities of 100. Delivery is 3-4 weeks, ARO.