Aerodynamic DDR4 DIMM sockets offer choice for designers

With higher data speed and lower operating voltage than DDR3, all DDR4 DIMM sockets meet JEDEC specifications and support UDIMM, RDIMM and LRDIMM memory applications for data, computing, telecommunication and networking servers. The sockets also feature moisture-resistant, high-temperature nylon with a Coefficient of Thermal Expansion, making them suitable for high-temperature processing operations.

A clean, solderless process is provided by the press-fit DDR4 DIMM sockets, which leads to the elimination of the added heat-cycle which can cause stress to the PCB or degrade electronic components. An additional benefit of this solderless process is that the cost of operation is lowered. The egonomically designed socket latches provide robust protection against high rip-out force and vibration, thus enhancing usability. The sockets allow for smooth module insertion through the dual-side lead-ins, while tand-offs at the base simplify solder-joint inspection, measurement and rework. Stress caused to the housing during terminal insertion is eliminated, while contact-stubbing is prevented, by the profiled contact terminals which also support up to 25 mating cycles. By providing a 0.85mm pitch, smaller than existing DDR3 sockets, the sockets enable compatibility in lead-free and halogen-free processing technologies. 

“Customers deploying enterprise-level server systems are looking for interconnect solutions that provide design flexibility and cost savings while enabling virtually fail-proof reliability through round-the-clock operation hours,” said Poon Wai Kiong, Global Product Manager, Molex. “By offering different styles and reducing the connector footprint for increased PCB space, Molex addresses these needs while offering superior electrical performance over the DDR3. And our innovative new construction material helps significantly reduce yield loss for greater cost savings and faster delivery.”