100Ω connector designed for high speed applications

Providing data rates up to 25Gbps, the Impact connector offers excellent signal density up to 80 differential pairs per linear inch when using a 6-pair configuration. Reducing PCB routing complexity and cost, the connector features an easy-to-manage 1.90x1.35mm grid and minimises board and system real estate usage. Designs can be optimised for superior mechanical and electrical performance in traditional backplane or midplane architectures thanks to the flexibility offered by compliant pin attach options of 0.39 and 0.46mm.

The Impact daughtercard mating interface uses an in-line staggered, bifurcated contact system. This reduces the mating force per pin and, without the need for multiple backplane signal-pin heights, also provides ground-signal sequencing.

Conforming to IEEE 10GBASE-KR and OIF Stat Eye Compliant end-to-end channel performance, the Impact Backplane family provides best-in-class versatility with available configurations of conventional, coplanar, mezzanine, orthogonal and orthogonal direct. Offered in 2-6 pairs, the Impact signal module options vary by configuration. Featuring current ratings of 60.0-120.0A per module, the Impact power modules are offered in 3-6 pair sizes in conventional, coplanar and mezzanine configurations

“Our network customers continue to require ever-higher data rates without sacrificing signal integrity. The Impact backplane system addresses the needs of these high speed systems with the fastest, most flexible and electrically clean connector solution on the market. The Impact system supports future system performance upgrades. Its broad-edge-coupled transmission technology enables high signal bandwidth while minimizing channel-performance variation across every differential pair within the system,” comments Steven Eichhorn, Group Product Manager, High Speed Backplane and Board-to-board Products, Molex.