100Ω backplane connector enables 25Gbps data rates

The connector features a 1.90mm x 1.35mm grid, which reduces PCB routing complexity and cost for designers. Supporting high bandwidth needs, the differential-pair Impact backplane system minimises board and system real estate usage. Compliant pin attach options (0.39mm and 0.46mm) provide flexibility to optimise designs for superior mechanical and electrical performance in traditional backplane or midplane architectures.  The Impact daughtercard mating interface utilises an in-line staggered, bifurcated contact system that reduces the mating force per pin and provides ground-signal sequencing without the need for multiple backplane signal-pin heights.

The connector is available in conventional, coplanar, mezzanine, orthogonal and orthogonal direct configurations. The module options vary by configuration and are offered in 2 through 6 pairs. The Impact power modules are available in 3 through 6 pair sizes in conventional, coplanar and mezzanine configurations with current ratings from 60.0A to 120.0A per module.

Designed for high speed networking equipment and storage servers in the data and telecommunications, medical, military and aerospace industries, the backplane connector conforms to IEEE 10GBASE-KR and OIF Stat Eye Compliant end-to-end channel performance.

“Our network customers continue to require ever-higher data rates without sacrificing signal integrity,” commented Steven Eichhorn, group product manager, high speed backplane and board-to-board products, Molex.  “The Impact backplane system addresses the needs of these high speed systems with the fastest, most flexible and electrically clean connector solution on the market. The Impact system supports future system performance upgrades. Its broad-edge-coupled transmission technology enables high signal bandwidth while minimising channel-performance variation across every differential pair within the system.”