Enclosures
New Rugged Conduction-cooled Chassis Provides Maximum Protection For Military And Aerospace Electronics
Schroff has introduced a new modular chassis designed to protect electronic systems from the extreme environmental conditions encountered in military and aerospace applications. As well as being able to withstand severe shock and vibration, the new Titan series of enclosures offers a choice of four thermal-management options and can be specified with IP/EMC gasketing for the harshest conditions.
DesiThe enclosure is made from high-grade machined aluminium alloys with protective chemical finishes and therefore provides the robust yet lightweight construction that is often a prerequisite for military and aerospace equipment.
In keeping with the VPX specification, PCBs are first mounted within purpose-designed clamshells, and these are then inserted into the chassis on a pitch of 0.80in., 0.85in. or 1.00in., depending on the customer's requirement. The clamshells not only provide extra protection but also help to remove heat from the boards.
The Titan chassis offers four options for external heat dissipation: a basic configuration where heat is removed by convection alone, the use of heat sinks attached to one or more sides of the chassis, the addition of sheet-metal covers over the heat sinks together with fans to provide forced-air cooling, and the use of liquid-cooled plates instead of heat sinks.
All the enhanced cooling elements - heat sinks, cover and liquid-cooled plates - are attached to the chassis using the same fixing points, and this modular approach to thermal management allows cooling capacity to be upgraded or adapted as required without difficulty.