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This system, developed for consumer applications, combines many PC functions on a small baseboard, approximately 10x10cm in size. To extend the benefits of this system to industrial applications a specific embeddedNUC standard has been established. The standard takes into account the interfaces relevant to industrial applications, the long-term availability of processors and other electronic components and failsafe, fan-less conduction cooling. Small and powerful PC units can now be used as decentralised control and monitoring units in automation systems.

enclosures4u now offers the Pentair-Schroff first ever compact enclosure compliant with the new standard, featuring an integrated cooling solution for PCB top side cooling which can expand and contract vertically to compensate for tolerances and optimise surface contact and provide thermal dissipation up to 15W.

The specification defines not only the electronic parameters concerning connectors, power supply, interfaces etc. but also mechanical aspects such as the size of the board (101.60x101.60mm) with the fixing holes and the heights and positions of the electronic components on the front and rear sides of the board. The basic dimensions of a case are determined by the board size.

The height of the case remains variable, since it has to be adapted to the height of the electronic components and to the conduction cooling. Similarly, cut out locations on the front or rear of the case for connectors remain undefined as these depend on the application. The defined temperature range for operation lies between 0 and +60°C or extended from -40 to 85°C.

The embeddedNUC enclosure is based on the Schroff Interscale platform of cases. It consists of just three parts and offers standard platform flexibility in dimensions, cut-outs, colours and printing. The IP30 rated EMC-shielded case is simple to assemble and is fixed in place with just two screws. Heat sinks for conduction cooling are integrated in the top cover.

Pentair has developed and patented special thermally conductive elements in metal to transfer the heat from the processors to the case surface. These elements are variable in height so that they can stay in constant contact with processors of different heights. The dissipated heat is transferred consistently by conduction to the heat sinks and then passed to the environment by means of convection and radiation. Another benefit of direct heat dissipation is better processor performance and higher clock speeds.