Schroff Air Baffles Efficiently Dissipate Heat In MicroTCA.4 systems

Applications of this nature require additional rear transition modules to accommodate the large number of I/Os on the rear front panels and to physically separate digital and analog I/Os, as well as high-precision clock and trigger signals. This specification is however also of interest to other market segments in industry, such as in test and measurement situations, where the same requirements often arise.

When the front or rear I/O slots of a MicroTCA.4 system are not fully occupied with boards, the gaps must be fully sealed to ensure optimal heat dissipation. The MicroTCA.4 specification defines air baffles that function as covers for unused slots, thus aiding efficient heat dissipation.

Schroff air baffles for the rear I/O area are available in double mid-size and double full-size. Four sizes are available to cover the front slots: single mid-size, single full-size, double mid-size, and double full-size. In addition, further baffles have been developed for use via a memory control hub or a power module (single mid-size and single full-size). All Schroff air baffles are supplied with a captive M3 screw.