Ohmite launch multi device heatsink
Capable of retaining up to four TO-264 or TO-267 resistors or semiconductors in a single heatsink, Ohmite’s new patented M Series is secured by circuit board mounting and the devices are held in place by a clever ASTM A228 spring clip, making mounting holes and fasteners unnecessary.
Constant, resilient spring force locks the components into place and ensures maximum repeatability even after constant assembly and disassembly. This method allows for device replacement or design changes without having to re-work the board.
Providing superior thermal efficiencies while reducing component and assembly costs, the M Series is supplied as a standard part measuring 55mm in length by 38.6mm high. However, Ohmite can supply the extrusion in other lengths in order to accommodate custom designs involving more or fewer resistors or semiconductors as required.
Available in both degreased and black anodised finishes, the multi device heatsink is the latest in a new range of heatsinks from Ohmite.
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