Enclosures
New MicroTCA system offers rear I/O for physics applications
Electronics packaging specialist Schroff has introduced a compact new MicroTCA system to meet the requirements of the proposed MTCA.4 subspecification for high-energy physics and other advanced test-and-measurement applications.
The The new Schroff MTCA.4 system is an ideal entry-level system for development purposes and consists of a 5U-high, 42HP-wide chassis complete with backplane, power supply and fan.
At the front there are six AdvancedMC slots in double mid-size format, one MicroTCA carrier hub (MCH) slot and one slot for a plug-in 300W PSU, while the rear of the unit provides six RTM (rear transition module) slots in double mid-size format.
With the 5U MTCA.4 system, users can test the board mechanics and functionality of the rear I/Os, including integration of the newly defined MicroRTM modules into the existing shelf management.
To ensure optimised heat dissipation, forced ventilation of the front and rear slots is provided by a built-in fan, which can be controlled by via the MCH.