MicroTCA subracks include backplane and shielding

16th March 2007

Schroff UK Ltd

ES Admin

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Schroff has introduced a new family of subracks specifically designed for applications based on the emerging MicroTCA specification. As well as incorporating full RFI shielding, the subracks are equipped with a MicroTCA backplane providing eight full-size AdvancedMC slots, four compact AdvancedMC slots, two MCH slots and two power-module slots. Available in 3U height for single AdvancedMC modules or 4U for double AdvancedMC modules, the subracks have a depth of 200mm and can be specified in different versions for mounting into either 19in. (IEC 60297) or metric (IEC 60917) cabinets.

The 3U height for single modules is necessary to accommodate M3 fastening screws above and below the card cage, as required by the MicroTCA specification.

Each MicroTCA subrack consists of aluzinc steel side panels, cover and baseplate and a rear EMC panel made from stainless steel. Hexagonal perforations in the cover and baseplate guarantee maximum air circulation while maintaining mechanical stability and high levels of EMI shielding.

The 1HP (5.08mm) pitch dimension of the subracks ensures that all three defined module widths – compact (3HP), mid-size (4HP) and full-size (6HP) – can be assembled together within the same unit.
The red plastic card guides at the bottom of the subrack are equipped with an AdvancedMC latch to enable the modules to be locked in place, while the green upper card guides incorporate ESD clips.
Also available from Schroff are various active fan units for dual-redundant thermal management and other accessories that allow the subracks to be built into complete MicroTCA systems.

In addition to its wide range of cabinets, subracks, cases and backplanes, Schroff offers a comprehensive system integration service for customers looking to reduce overheads and product development times by outsourcing some or all of their design and manufacturing activities.