eTEC MA Series unveiled by Nextreme

4th July 2013

ES Admin

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A new series of thin-film thermoelectric modules has been unveiled by Nextreme Thermal Solutions, offering higher cooling capacity, robust mechanical design, and source-matched heat flux density allowing for easier integration into existing electronic systems. The eTEC MA8000 Series stands at 1.1mm high and is designed to provide low-profile thermal management solutions for medium heat flux applications in markets including photonics, aerospace, test and measurement, and electronics.

The MA8000 Series’ heat flux densities ranging from 16 W/cm² to 22 W/cm², the MA series offers the ability to match thermoelectric cooling designs more easily to heat sources and existing convection-based heat rejection systems. The MA8000 Series comprises of five new modules that can pump from 10 to over 80 watts of heat at an ambient temperature of 25°C with footprints ranging from 63 to 375 mm². The new modules fill the gap between traditional thermoelectrics that offer 6-8 W/cm² and Nextreme's HV series that pumps heat in excess of 100 W/cm².

The MA8000 series includes a seal ring which serves as a barrier to moisture and other contaminants that could affect the performance of the module. The seal ring’s high-strength is made from Cirlex polyimide film which provides mechanical isolation across the thermoelectric device, eliminating vertical force and sheer issues.

The introduction of the MA series significantly expands our thin-film product line, quoted Dave Koester, vice president of engineering for Nextreme. The greater cooling capacity, lower heat flux density, and robust design will open up new applications for our thermoelectric products.

Commercial shipments of the eTEC MA8000 series will begin in the first quarter of 2013. Pricing is available upon request.