Enclosures target quick-turn delivery of high IP systems

2nd July 2014

Staff Reporter

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A family of high IP modular enclosures, designated the ADLMES-8200 series, has been introduced by ADL Embedded Solutions. Available in three variations, the ADLMES-8200 is aimed at quick-turn delivery of rugged or extended temperature enclosures for a variety of applications. The modular sidewall design supports variable PC/104 stack heights, ADL Embedded Solutions' 3.5" SBCs and other SBC intelligent systems.

The enclosure achieves quick-turn, high IP systems through its modular architecture, high-availability of inventory, quick-turn custom faceplate/backplate support and readily available high-IP connectors. Conduction cooling is delivered through the finned-chassis design, either through the base to airframe, vehicle bulkhead or passive cooling via the finned chassis surface which can be augmented with forced cooling. Up to IP65 Ingress-Protection is possible with appropriate faceplate and connector options.

The enclosure is only available as part of a full system and is supported by ADL Embedded Solutions' team of Solidworks engineers to provide design and 3D modeling support. The company's portfolio of PC/104 SBC options, which range from low-power lntel Atom to high-performance 4th generation Intel Core i7 Quad processors, enable full quick-turn system solutions including internal hardware. Compatible power supply options are also available.

The three variations of the ADLMES-8200 include:

ADLMES-8200-LP low profile 2-card chassis, measuring 3.2” x 7.0” x 6.6”
ADLMES-8200-P1 4-card chassis, measuring 4.6” x 7.0” x 6.6”
ADLMES-8200-P2 6-card chassis, measuring 5.9” x 7.0” x 6.6”

Marin Kristof, Managing Director, ADL Embedded Solutions says, “Quick time-to-market has become a critical success factor for many SFF systems. The ADLMES-8200 family of quick-turn, high-IP package solutions – coupled with ADL Embedded Solutions’ broad portfolio of SBCs, power supplies and design services – helps fill this need with significant reductions in development time for embedded engineers.”