Enclosures

Enclosure solution offers multiple design options

9th June 2015
Jordan Mulcare
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HEITEC presents its Ripac Vario module family extension as a cost-efficient, robust and flexible enclosure solution which offers multiple design options, as well as an off-the-shelf variants for the quick, easy and precise adoption to customer-specific applications.

Available as a system or table-top case and rack-mount enclosure, as well as in heights of 2 to 7U and widths of 42, 63 and 84HP, they can be installed into 19" racks. Compatible with the existing Ripac Vario module programme, the enclousres are configurable and deployable in multiple ways.

The mounting of various backplanes is possible, as are different power supply and fan solutions, e.g. perforated top and bottom covers enable fan-less operation. The case can be easily turned from a table-top to a rack-mount enclosure. If required, EMC variants to the Ripac Vario module versions are avaliable which include conductive contact points, EMC gaskets and a specifically designed structure.

Using variable extensions and horizontal rails, as well as mounting plates for free wiring, the enclosures can be expanded.

A wide range of accessories, consisting of top and bottom covers, front and rear panels, flanges, positioning feet, carrying handles and mounting brackets, enable greater flexibility. The design is robust: the side walls, side panels and cross profiles are made of extruded aluminium, while the corner trims are made of die-cast zinc.

Due to this modularity and its compatibility with the existing Ripac Vario Module programme, this family offers enclosure solutions for applications demanding robustness, security and quick and easy individual adoption or expansion. It is suited for the assembly of microcomputer systems, laboratory devices and test and measurement instruments.

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