Schroff at DSEi 2011

17th June 2011

Schroff UK Ltd

ES Admin

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The highlight of the Schroff stand at DSEi 2011 will be the company’s Varistar MIL 901D ruggedised 19in. cabinet, which has been designed to protect sensitive electronic systems from demanding environments such as those encountered during operation at sea. Suitable for use on frigates, aircraft carriers and submarines, the cabinet has been independently tested in accordance with the MIL-STD-901D standard to confirm its robustness and stability under conditions of extreme shock. In addition, its vibration resistance satisfies the requirements of MIL-STD-167.

The cabinet provides IP55 sealing against the ingress of dust and moisture, while its frame and covers are galvanised and powder coated to protect them from corrosion.
Helping to keep project costs in check through the use of COTS technology, the MIL 901D model is based on Schroff’s standard Varistar cabinet, with expertly engineered modifications to enable it to cope with the rigours of naval applications.
Four shock absorbers are attached to the cabinet’s welded base plate and two more are fixed to the rear of the solid top cover, for wall mounting. The shock absorbers are designed for each individual application, with the type and size determined by variables such as the cabinet dimensions, the weight of the components housed in the cabinet and the position of its centre of gravity.
Also on the Schroff stand will be the Series 223 and 224
Card-Lok PCB retainers from sister company, Calmark. These incorporate a patent-pending torque-limiting feature that enables a PCB assembly to be fixed into a chassis at a prescribed clamping force without the need for a torque wrench. Primarily aimed at cold-plate heat-transfer applications within the defence and aerospace sector, these five-wedge devices are designed to prevent damage to the PCB or to the Card-Lok itself due to over-tightening.
Rounding off the display will be Schroff’s range of ruggedised VPX clamshells, which not only protect boards from the effects of shock and vibration but also provide an efficient conduction cooling method for transferring the heat generated by high-performance components.