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DEK’s revolutionary new closed loop innovation, ProDEK, takes centre stage at SMT Hybrid Packaging

2nd July 2012

ES Admin

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DEK gave centre stage to its revolutionary new closed loop innovation, ProDEK, at SMT Hybrid Packaging 2012 in Nuremberg earlier this month. Showcased for the first time in Europe at the show, ProDEK introduces a greater degree of dynamic print process control, enabling real-time continuous alignment adjustments and cleaning frequency adaptation that dramatically enhance throughput, improve yield and limit operator intervention.

In fact, when ProDEK was field tested at several leading electronics assembly firms, there was an average of nearly 50% reduction in defects from the offset correction functionality alone.

“It was great to be able to show delegates at SMT Hybrid Packaging how ProDEK can make their printer smarter and more intuitive,” said Stefan Techau, General Manager Electronics Assembly for Europe at DEK. “Working alongside solder paste inspection and developed with unique print software capability, ProDEK uses a high level of process reference to provide print alignment precision and cleaning functionality.”

At the show, DEK also showcased its total optimised solution with the combination of Nano-ProTek, a breakthrough stencil coating technology that delivers high performance stencils in a cost-effective wipe, SMT Under-Stencil Cleaning Fabric Roll and water based chemistry, Pro XF. With the total optimised solution, the cleaning process is minimized, yet fast and effective when needed, reducing the total cost of ownership.

DEK’s productivity tools, which are designed to further extend the capabilities of even the most advanced technologies, were also on stand, including ProActiv, HawkEye Bridging, ProFlow ATx and Over Top Snuggers.