Enclosures
Conduction-cooled keying complies with VITA 1.6 for military and ruggedised systems
Electronics packaging specialist Schroff is now offering a conduction-cooled keying system aimed at applications that do not use conventional front-panel assemblies – for example, in military and ruggedised systems.
ManuWhereas a conventional system can accommodate keying between the front panel and the card guide, the mating halves of the CCK coding keys are attached to the rear edge of the board and the backplane of the system.
The devices are fully compliant with the VITA 1.6 standard, which defines a keying system for VME64x boards and backplanes in an IEEE 1101.2 conduction-cooled environment. In addition, they can be used successfully in IEEE 1101.10 non-conduction-cooled applications where there is no front panel.
Available in six different configurations, the coding keys feature a choice of gold or clear chemical film finish and can be specified with metric or imperial threads. They are supplied individually or in kits containing two mating pairs, with mounting screws and washers included.