Compact case features an integrated cooling solution

To extend the benefits of the system to industrial applications, the SDT.03 working group of the SGET e.V. standardising consortium has developed and published a specific 'embeddedNUC' standard as a foundation.

The standard takes into account the interfaces relevant to industrial applications, the long-term availability of processors and other electronic components and failsafe, fan-less conduction cooling. Small and powerful PC units can now be used as decentralised control and monitoring units in automation systems.

The Schroff embeddedNUC case is based on the Schroff Interscale platform of cases. It consists of just three parts (body, top cover and front panel) and offers standard platform flexibility in dimensions, cutouts, colours and printing etc. The EMC-shielded case is simple to assemble and is fixed in place with just two screws. Heat sinks for conduction cooling are integrated in the top cover.

The company has developed and patented special thermally conductive elements in metal to transfer the heat from the processors to the case surface. These elements are variable in height so that they can stay in constant contact with processors of different heights. The dissipated heat is transferred consistently by conduction to the heat sinks and then passed to the environment by means of convection and radiation. Another benefit of direct heat dissipation is better processor performance and higher clock speeds.