ECT Compliant Connector Solutions Introduces Sliver Technology

The marketplace continues to drive evermore complex packaging. Common solutions are either too tall or face early failure due to insufficient strain distribution. ECT’s Sliver combines traditional bending techniques with its sliding technology, creating a contact that will maintain its compliance characteristics time after time.

With the height dilemma solved, Sliver also fits comfortably in today’s high-density packages. The density and height parameters are designed to specification for each application. One recent design achieved a 0.025 (0.63 mm) compressed height on a 0.026 (0.65 mm) grid. The uncompressed height of the contact is 0.037 (0.094 mm), an impressive 50 percent compliance-to-height ratio.