Card guides suitable for standard IEEE air-cooled enclosures
Card guides for conduction cooled modules are now being offered from Pixus Technologies, which can be used in standard IEEE air-cooled enclosures. The card guides facilitate plugging of conduction-cooled modules into a backplane for testing and development.
The conduction-cooled card guides are offered as part of Pixus’ Test/Development chassis for OpenVPX, CompactPCI, and VME/VME64x systems. They fit in IEEE 1101.10/.11 modular extrusions. The guide rails are designed for 160mm deep cards, but customised depths are available upon request.
Pixus also offers standard plastic card guides for air-cooled boards. This includes colour coded versions for system, node, and power slots as well as multiple depths. The company also provides embedded enclosure components and full systems including extrusion rails, threaded inserts, sidewalls, handles/panels, top and bottom covers, ESD clips, gaskets, and much more.
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