Aluminum heat sinks improve heat dissipation

The extruded and stamped heat sinks offer tin plated or black anodized material finishes and are available with or without solder pins in vertical or horizontal orientations. Thermal resistances measured at 75°C ΔT in natural convection environments are as low as 4.49°C/W, while power dissipation ratings measure up to 16.7 W at 75°C ΔT in natural convection.

Along with their standard form factors and sizes, CUI Devices also offers a range of custom heat sink capabilities. With alternate production methods such as forging and die casting as well as extrusions and stampings, CUI Devices can create virtually any shape or profile to fit specific design needs. A variety of additional materials and finishes are available, including clear and color anodization, chromate powder coating, and nickel or zinc plating. Hole punching for custom mounting patterns is also an option. In addition, CUI Devices' standard or custom heat sinks can be integrated with any of its current Peltier and dc fan offerings to achieve more complex thermal solutions.

“At CUI Devices, we see the development and expansion of our thermal management product line as a natural complement to our industry leading portfolio of power products,” stated Kraig Kawada, CUI Devices' VP of Product Management. “As the heat in applications continues to rise due to increasing power densities, we believe that the introduction of these heat sinks, along with our current Peltier devices and dc fans will assist our customers in meeting their growing thermal management challenges.”

The entire product line of extruded and stamped aluminum heat sinks is available immediately with prices starting at $0.17 per unit at 1000 pieces through distribution.