Enclosures

New from electronics packaging specialist Schroff is a 16-page, full-colour brochure detailing the company’s capabilities for producing complete enclosure systems, which typically comprise a subrack or case, backplane, power supply, cooling unit and system management module.

In response to the development of more mobile and independent electronic devices, and the growing use of touch screen technology, with graphical interfaces rather then traditional keypads, OKW have developed the new INTERFACE-TERMINAL enclosures.

Schroff has introduced a new family of compact MicroTCA cubes, which are designed to enable users to create cost-effective systems for industrial control. In many such applications, there is no need for either full redundancy or many of the system management functions defined in the MicroTCA standard, so Schroff has developed the cubes to minimise costs while retaining the functionality required for the use of conventional AdvancedMC modules.

Vero Technologies has added six new colours - red, yellow, blue, green, black and brilliant white to the standard options available for all models in its plastic enclosures family. Moulded in flame retardant ABS, the enclosures are designed for a wide range of applications, ranging from hand-held instruments, remote controllers, flying lead machine controllers test and measurement equipment, machine and robot controllers, detection equipment, dat...

TEKO has introduced the new TEKMAG range. These new IP 67 hand-held cases are manufactured in TEKNIUM a magnesium based alloy with super strength, ultra lightweight and high shielding characteristics. This is the first time such a material has been used on a standard enclosure, and ensures suitability for very high tech applications such as industrial automation, medical, avionics, marine and automotive equipment.

Electronics packaging specialist Schroff has published a new brochure detailing the company’s wide range of enclosures and embedded systems for use in railway applications. The 28-page A4 brochure starts with an overview of Schroff’s capabilities and illustrates the typical locations where its products are found, such as inside trains, trackside, in signal boxes and at stations.

Working in collaboration with a partner company, Schroff has developed a self-adhesive fabric gasket with a triangular profile that has been granted a patent by the European Patent office. Specifically designed for narrow gaps, the new gasket profile is now being used on shielded versions of Schroff’s range of AdvancedMC modules, which are compatible with both AdvancedTCA and MicroTCA systems.

Rittal has introduced a range of AdvancedTCA and MicroTCA air management systems to enhance the cooling performance in ATCA and µTCAshelves. Due to steadily increasing power demands, heat output is on the rise. To ensure that any crucial cooling airflow is not wasted by escaping from any unused slots in the chassis, Rittal has developed a filler panel which acts as a barricade to prevent any valuable unused cooling air from escaping.

The LBX from Verotec is a solution for users who need to mount standard Eurocard sized PCBs and modules in a desktop enclosure. Fabricated in steel, the LBX is sized to accept 3U and 6U boards in both 160 and 220mm board depths and can accommodate standard front panels in the popular 4, 6, 12 and 24HP widths.

Electronics packaging specialist Schroff has launched a family of 19in plug-in units that feature a slide-in cover plate, providing a significant reduction in assembly time compared with screw-on cover plates. Known as Frame-type plug-in unit PRO, the new range is designed to protect PCBs from mechanical damage and electrostatic discharge while maintaining the airflow necessary for effective thermal management.