Enclosures
New brochure presents electronics packaging solutions for bus-based systems
Electronics packaging specialist Schroff has produced a new brochure summarising the company’s comprehensive product offering and support services for bus architectures such as CompactPCI, VME, VME64x, VPX, MicroTCA and AdvancedTCA.
Flat pack enclosures with FDB and SNAP-LINE
As specialists in cabinet hardware and “Panel Fittings for Every Enclosure” FDB were excited by the possibilities of the SNAP-LINE range for use in fabricating flat pack enclosures as illustrated by the videos available on FDBs Website and Youtube channel. The D-SNAP technology has been designed for quick easy use and has been applied to a full range of components from panel joiners to hinges and swinghandles so that a complete assembly may b...
Verotec introduces eleven new integrated development systems
Verotec has developed eleven new models in four families of integrated development systems for stand-alone desktop or rack mount environments. Equally suitable for the hardware/software development environment and for use as the packaging for the finished system, the modular units are configured from the company’s standard ranges of enclosures, subracks, backplanes, thermal management products and power supplies.
New Ohmite heatsinks designed for higher power densities
By adding a cam-clip and eliminating the need for a screw hole, the rear side of Ohmite’s new R Series heatsink benefits from being fully populated with extra fins which provide a larger cooling surface area and a significant improvement in thermal performance while using less space.
‘BLOB’ – Ground Breaking Plastic Enclosures from OKW
For 2012 OKW has launched its latest innovation in plastic enclosures – the ‘BLOB’ series. In developing these new enclosures, OKW set out to create a completely different style of housing that would employ touch and feel to impart the functionality of the electronics. The forms employed had to be suitable for a wide range of users with different hand sizes and grasping volumes.
X-ES Introduces ½ ATR System with Increased Cooling Capability for Demanding Military Applications
X-ES is shipping the XPand4201, a sub-½ ATR, forced air-cooled enclosure for conduction-cooled modules. The XPand4201 is designed to reduce the Size, Weight, and Power (SWaP) of deployed military systems. A fully populated XPand4201 weighs less than 19 pounds and is ideal for C4ISR applications in vehicles such as UAVs, helicopters, planes, tanks and light armored vehicles, HMMWVs, and UGVs.
Hammond Manufacturing Announces New Brand for Economy Product Line
The next time you are heading to your favourite DataComm distributor to purchase a Hammond Rack or Cabinet, you may notice a new line of products offered by Hammond. Hammond’s new line of rack and cabinets named RACK BASICS will offer contractors with a quality economy option at a competitive price.
Advanced management solution for greater energy efficiency in data centres
Data centres can account for half the power consumption of a company and on average 37 percent of this is used for cooling. By integrating Rittal RiZone with IBM's MMT (Management and Measurement Tool) a comprehensive energy management solution is available for all parts of a data centre that can monitor, actively regulate and reduce their data centre's energy consumption by more than 10 percent.
ROLEC’s New User Friendly ‘aluPLUS’ Diecast Enclosures
The new ROLEC IP 66 ‘aluPLUS’ diecast enclosures have many sophisticated and user friendly design features built-in as standard. These make installation of the electronics and electrical components much easier than with traditional rectangular diecast housings.
IGT Industries Custom Control Panel Solutions
IGT Industries offers its customers a time and cost saving single source for complete in house control panel design and manufacture. IGT-Industries HMI products are suitable for use in Marine, Aviation, Railway, Medical, MIL, Industrial, Fire, Security, Telecom and most other electronics applications