Low power embedded boards feature thin-profile designs

That makes these boards a suitable solution for a whole range of fanless and energy-saving embedded applications such as industrial automation, retail industries and healthcare. DFI’s BW171 and BW173 Mini-ITX motherboards are designed with only 25mm in height and include a variety of I/O connectivity.

In addition, the optional power connectors (including right angle connector, vertical type connector, and DC-in jack) are available for customers to easily assemble their all-in-one thin systems. The two thin Mini-ITX also support three independent displays, VGA+LVDS+DP++, with Intel HD graphics to deliver up to 3840x2160 high resolution. Thanks to the above features, BW171 and BW173 are suitable for universal retail applications as digital signage, vending machines and small POS systems.

The BW051 is the all new Pico-ITX form factor measuring at 100x72mm with DFI’s SBC platform design and it features a small-sized mainboard to easily integrate into various space-limited applications with substantial I/O requirements. Additionally, DFI’s new embedded SBC boards, BW551 and BW051, are equipped with proprietary optional heat spreader with low thermal dissipation to satisfy fanless and mobile system integrations.

These embedded boards also offer flexibility with multiple expansion interfaces: PCIe x1 slot, mSATA slot, Mini PCIe slot, and SIM card socket to expand and fulfill diversified computing applications such as: portable medical devices and fanless healthcare panel PCs.

DFI’s embedded boards are specially designed by industrial-grade components with 100% Japanese CAP and polymer capacitors to ensure long product lifecycle and MTBF. Furthermore, the 15k high ESD protection on all I/O ports prevents any damages to the internal components from static electricity and ensures system’s robustness in harsh environments.

DFI also provides a high-qualified testing environment in thermal cycle testing, thermal profile temperature and capacitor temperature for all heat-generated parts. With these rich features, the four new board-level products comprehensively satisfy most of the embedded smart solutions.