DSP development platform opens way to IoT prototyping

21st October 2015

CEVA Inc

Mick Elliott

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A new silicon-based DSP development platform to accelerate the deployment of ‘smart and connected’ devices has been unveiled by CEVA. The platform incorporates processing, connectivity, sensing and application software which are key building blocks for prototyping IoT devices, targeting a broad range of end markets including mobile, wearables and the smarthome.

The platform is built around a power-optimised CEVA-TeakLite-4 DSP and subsystem implemented in silicon through a collaboration with SMIC who fabricated it at their IoT-centric 55nmLP process.

Running at 500MHz, the DSP provides designers with a powerful means to add ‘smart and connected’ capabilities to these devices, including always-on sensing, local processing and intelligence and connectivity.

The platform also provides real-time power measurement that allows developers to optimise and power-tune their DSP software.

The CEVA Smart and Connected Development Platform incorporates the following elements:

DSP development chip: 500MHz CEVA-TeakLite-4 and subsystem of integrated peripherals (TDM, DMA, I2C, I2S, ICU, Timers, GPIO, etc.)
Host CPU: Linux running on-board ARM Cortex-A9 for complete CPU + DSP system prototyping
Connectivity: multiple wireless technologies available from CEVA and its partners, including Bluetooth Smart and Smart Ready, Wi-Fi, ZigBee and GNSS
Peripherals and interfaces: including on-board digital (MEMS) microphones, I2C I/F for sensors, audio CODEC with digital and analog audio in/outs, USB, UART, PCIe, and Ethernet ports, user configurable FPGA, GPIOs, DDR memory, SD card, and LCD display
Arduino connectors and drivers: allows Arduino Shields to be connected to the board, leveraging a massive ecosystem of Arduino-related products
CEVA’s Android Multimedia Framework (AMF) for offloading Android tasks from CPU to DSP to enhance always-on functionality and long audio playback time
RTOS and DSP libraries: multi-tasking RTOS and a DSP library to jumpstart system design

In addition, CEVA and its broad ecosystem of partners offer audio, voice and sensing software and applications that are fully optimised for the CEVA-TeakLite-4 DSP, including Sensory’s always-on voice activation and speech recognition, NXP Software’s multi-microphone noise reduction, Cypher’s neural-network based voice isolation technology, Cywee Motion sensor-fusion algorithms and more than 100 other software functions.

CEVA will demonstrate the ‘smart and connected’ development platform at its upcoming Technology Symposiums, October 26-30 in China and Taiwan.