Computer-on-module delivers high-speed connectivity

Extending Kontron’s product family of server-grade COM platforms, the industrial specification COMe-bEP7 features AMD EPYC Embedded 3000 SoC processors which deliver cost effective, highly scalable server-class performance in a compact form factor.

Suitable for a broad range of high-performance server applications, the Kontron COMe-bEP7 Type 7 offers scalable performance with up to sixteen processor cores.

Four optional SODIMM sockets provide up to 128GB DDR4 RAM of memory.

Networking capabilities and connectivity are ably supported with four 10Gb Ethernet interfaces and up to 32 PCIe Gen 3 lanes.

Two SATA ports are provided, with the option to integrate an onboard NVMe if required.

Peter Marchant, embedded division manager, RDS said, “With a wealth of experience and knowledge in the design, manufacture and support, Kontron continue to deliver high quality, high performance, cost-effective embedded computing platforms. The COM Express-bEP7 is no exception and features a robust design offering a versatile, scalable solution with comprehensive high-speed connectivity, and a broad range of memory options.”

The industrial-grade COMe-bEP7 module can operate reliably in extreme temperature environments from -40°C to +85°C.

On board peripheral support includes four USB 3.1, four USB 2.0 as well as LPC, SPI Flash, SMB, dual staged Watchdog and RTC.

Additional specific features include a Trusted Platform Module (TPM 2.0) for enhanced security.

With compact mechanical outline dimensions of just 95mm (h) x 125mm (w), and designed for use with a carrier board, the robust Kontron COMe-bEP7 is suited for a range of headless (no display) high-performance server applications.

These include embedded edge and micro servers, medical image processing, artificial intelligence, camera inspection systems, and test and measurement equipment.

The Kontron COMe-bEP7 is now in stock at Review Display Systems.