Boards/Backplanes

The new K24 I/O development kit from Avnet is the latest offering for the AMD Kria System-on-Module (SOM) portfolio.

ERI Inc., NGK INSULATORS, LTD., and Torex Semiconductor Ltd have jointly developed the Environmental Power Generation Demo Board (EsBLE).

The XPLR-HPG-1 Explorer kit from u-blox is now being shipped by authorised distributor Mouser Electronics.

Cambridge GaN Devices (CGD) is partnering with Qorvo to develop a reference design and evaluation kit (EVK) that showcases GaN for motor control applications.

SECO, a specialist in delivering end-to-end technological solutions for industrial digitalisation, has announced its participation at embedded world China, the premier exhibition for embedded system technologies taking place in Shanghai, 14–16 June 2024.

The Raspberry Pi Foundation, in collaboration with Hailo, announces the release of the Raspberry Pi AI Kit.

MYIR has launched a new embedded System-On-Module (SoM), the MYC-J7A100T, powered by the Xilinx Artix-7 XC7A100T FPGA chip and a high-density and speedy circuit board design.

JAE’s WP86SD series of board-to-board (FPC) connectors are ideal for small devices that require higher-density components to maximize space while supporting the higher currents needed for fast charging.

MIKROE has launched 4G LTE&GNSS Click, a compact add-on board designed for advanced global tracking and telematics applications, enabling developers to build highly efficient and smaller solutions without compromising performance.

The world of electronics manufacturing is evolving rapidly, with electronic components becoming increasingly smaller and more densely packed. As this trend continues, thorough rework cleaning after a PCB (printed circuit board) rework becomes crucial to ensure the quality, reliability, and performance of electronic assemblies.