Boards/Backplanes

In a move to make development of IoT devices more efficient Avnet has released the Monarch LTE-M Development Kit.

congatec has introduced the first carrier board and cooling solutions building the foundation of the new ecosystem for the brand new PICMG COM-HPC standard. They are a major milestone for the COM-HPC integration and have been created to accelerate the utilisation of congatec’s COM-HPC modules based on the latest 11th Gen Intel Core processors (code name Tiger Lake).

congatec has broadened the application areas of its AMD Ryzen Embedded processor based COM Express Type 6 platforms towards smaller but more powerful system designs by premiering the brand new AMD Ryzen Embedded V2000 processor launched today on the COM Express Compact footprint.

congatec has introduced new application-ready platforms for tactile internet applications over public broadband as well as private IP networks. They support Time Sensitive Networking (TSN) in combination with the new Intel Time Coordinated Computing (Intel TCC) technology, which complements the TSN Ethernet standard based on latest Intel IP technology.

Anglia is supporting the accelerated design of automotive systems and similar projects in robotics, automation and other industrial applications with a comprehensive suite of development boards from STMicroelectronics.

Avnet Silica has unveiled the HoriZone RA development kit, which is designed to enable ‘proof-of-concept’ for edge-to-cloud Internet of Things (IoT) applications requiring secure communications.

IBASE Technology has announced the launch of the ET977 low-power COM Express Compact Type 6 modules, which are based on the AMD Ryzen Embedded SoC to enable next-generation embedded designs. The series targets a wide range of applications including AIoT, retail, medical, transportation, automation and gaming fields.

Available now from RDS is the new AAEON BOXER-8251AI powered by the Jetson Xavier NX from NVIDIA.

Elma Electronic has released a new rugged ATR chassis compliant with VITA 48.4 for liquid flow-through (LFT) cooling. The new backplane in the chassis is designed for data rates up to 10 Gbps and can handle 300W per slot. This enables the system to accommodate the intense thermal management needed in high density embedded computing systems. 

The Artemis Development Kit with Camera from SparkFun is in stock at distributor Mouser Electronics, Inc.