Boards/Backplanes
SMARC 2.1 modules with NXP i.MX 8M Plus processor
congatec has presented a low power SMARC 2.1 Computer-on-Modules with NXP i.MX 8M Plus processor for industrial edge analytics, embedded vision and artificial intelligence (AI) at embedded world 2021 DIGITAL.
COM-HPC starter set with 11th Gen Intel Core processors
congatec has introduced a brand new COM-HPC starter set. Optimised for modular system designs utilising the latest high-speed interface technologies such as PCIe Gen4, USB 4.0 and up to ultra fast 2x25 GbE connectivity as well as integrated MIPI-CSI vision capabilities, the starter set is based on congatec’s PICMG COM-HPC Computer-on-Module conga-HPC/cTLU, which leverages 11th Gen Intel Core processor technology (code name Tiger Lake).
Updated guidelines on PCB fabrication and assembly
Bittele Electronics has released an updated DFM and DFA Handbooks that detail best practices for printed circuit board (PCB) fabrication and assembly. The handbooks also describe Bittele's fabrication capabilities, suggestions for cost reductions, and design recommendations for optimising PCB fabrication and maximising PCB assembly efficiency.
MIL-grade version of RX310 software defined radio
Pixus Technologies has announced a new implementation of its ruggedised enclosure utilising NI’s Ettus Research brand Software Defined Radio (SDR).
SMARC 2.1 modules with NXP i.MX 8M Plus processor
congatec has presented its new low power SMARC 2.1 Computer-on-Modules with NXP i.MX 8M Plus processor for industrial edge analytics, embedded vision and artificial intelligence (AI) at embedded world 2021 DIGITAL.
New COM-HPC starter set at embedded world
congatec has presented a new COM-HPC starter set at embedded world 2021 DIGITAL. Optimised for modular system designs utilising the latest high-speed interface technologies such as PCIe Gen4, USB 4.0 and up to ultra fast 2x25 GbE connectivity as well as integrated MIPI-CSI vision capabilities, the starter set is based on congatec’s PICMG COM-HPC Computer-on-Module conga-HPC/cTLU, which leverages 11th Gen Intel Core processor technology (cod...
New embedded pITX iMX8M motherboard released
Kontron has announced that it is launching the pITX iMX8M motherboard in a compact 2.5” pico-ITX format, a high-performance SBC solution for embedded applications in manufacturing or for deployment as an IoT gateway. The iMX8M features dual- or quad-core NXP CPUs based on the Arm Cortex-A53 architecture running at up to 1.5GHz.
Official ratification of COM-HPC specification
PICMG has announced that COM-HPC has been approved and ratified, and is now available for public download and distribution.
Extended temperature range platforms for edge computing
congatec has focused on customers’ ruggedisation challenges for virtual embedded world 2021, and will be presenting extended temperature range platforms for all performance levels, from high-end COM-HPC to low power SMARC modules.
Kontron further expands its SMARTCASE kit solutions
Kontron has announced that it is expanding its portfolio of SMARTCASE products, consisting of five variants to date, to include the SMARTCASE S711. The case kit is specifically designed for the D3713-V/R mini-ITX motherboard.