Boards/Backplanes

Avalue Technology is bringing the new 1.8-inch embedded SBCs (single board computers), EZX-EHLP, with the Intel Pentium/Celeron/Atom system on chip BGA (ball-grid array) processor (Elkhart Lake Platform 4.5~12W), CPU bottom mounted, with huge improvement on performance and bug step ahead with Intel UHD Graphics target entry-level application market.

ASMPT Semiconductor Solutions (SEMI), a maker of mainstream and advanced equipment for semiconductor assembly and packaging, will exhibit its products at the Electronica 2022 trade fair being held 15 – 18 November 2022 in Munich.

u-blox, a global provider of positioning and wireless communication technologies and services, announces that Move-X has chosen to integrate u-blox positioning technology and u-blox cloud positioning service in their LoRa connectivity solution – the Cicerone board.

KDPOF introduces an automotive Ethernet switch EVB9351-AUT-SW-NXP with five 1000BASE-RH optical ports, each comprised of KDPOF’s KD9351 FOT and KD1053 PHY IC.

NVIDIA has introduced NVIDIA DRIVE Thor, its next-gen centralised computer for safe and secure autonomous vehicles.

With the FN990Axx series, Telit is expanding its portfolio with the next gen of 5G data cards with exclusively sub-6 technology for LTE, WCDMA, and GNSS support.

Leader Tech's Modified CBS products use existing tooling and manufacturing processes to create near-custom solutions with short lead times and little or no NRE, while providing all the same benefits of its CBS products. This allows for any parameter size and custom shapes to provide optimal shielding and save board space.

Austin American Technology (AAT) is pleased to announce that it has further expanded its brand by adding Restronics as its representative/distributor in Southern California.

Keysight Technologies, a specialist technology company that delivers advanced design and validation solutions to help accelerate innovation, has announced PathWave Advanced Design System (ADS) 2023 for high-speed digital (HSD) design with Memory Designer capabilities for modelling and simulation of next-gen interface standards such as Double Data Rate 5 (DDR5).

Specialist in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications.