Boards/Backplanes

STMicroelectronics has expanded its STM32 family of advanced microcontrollers (MCUs) with extra STM32U5 devices that raise performance while squeezing power consumption for longer runtimes and energy efficiency. The STM32U5 has also received NIST embedded random-number entropy source certification1; the industry’s first to receive this endorsement.

Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium, the industry Consortium dedicated to advancing UCIe technology.

The ASRock IEPF-9010S-EY4 high-performance GPU AI system is now available from Impulse Embedded and provides a rich selection of I/O and storage options.

Adeia has announced that Qorvo has licensed Adeia’s hybrid bonding technology.

OKW’s RAILTEC SUPPORT open PCB holders for TH35, TH15, and G32 DIN rails are now available in light grey as standard.

IBASE Technology has launched the MI836 Mini-ITX motherboard based on Intel Atom x6000E processors, with TDP ranges from 6W to 12W. It supports both passive and active thermal solutions with a wide operating temperature range from -20°C to 70°C, ensuring reliable operation even in outdoor and semi-outdoor environments.

Review Display Systems (RDS) has announced the availability of a new 3.5-inch SubCompact SBC from AAEON.

With the Video Dragon 6222 product family, GOEPEL electronic offers powerful tools for testing camera- and display-based advanced driver assistance systems (ADAS).

congatec will be presenting its comprehensive COM-HPC ecosystem at embedded world 2023 (hall 3/booth 241). The portfolio now ranges from high-performance COM-HPC Server-on-Modules to ultra-compact and brand-new COM-HPC Client-on-Modules that is hardly larger than a credit card.

Variscite has launched the VAR-SOM-AM62 system on module, powered by the Texas Instruments AM62x.