Boards/Backplanes
Supermicro expands AMD product lines
Supermicro is announcing that its entire line of H13 AMD based-systems is now available with support for 4th Gen AMD EPYC processors, based on ‘Zen 4c’ architecture, and 4th Gen AMD EPYC processors with AMD 3D V-Cache technology.
AMD reimagines Cloud performance with 4th gen AMD EPYC processors with AWS
During the ‘Data Centre and AI Technology Premiere,’ AMD announced a continuation of its relationship with Amazon Web Services (AWS) with a preview of the next generation Amazon Elastic Compute Cloud (Amazon EC2) M7a instances, powered by 4th Gen AMD EPYC processors.
iWave launches SoM for secure and reliable Linux edge processing solutions
iWave adds to the iW-RainboW-G50M family: The Solderable NXP i.MX 91-based LGA System on Module (SoM).
Industrial motherboard supports extensive graphics performance
Embedded systems and display solutions provider, Review Display Systems (RDS), has announced the introduction of an AMD-powered mini-ITX single board computer (SBC) from global provider of embedded technology, Kontron.
Dual-band evaluation board for Wi-Fi and Bluetooth
In stock at distributor Digi-Key is Silicon Labs’ RS9116 wireless dual-band evaluation board.
MI997 Mini-ITX motherboard for 12th Gen Intel Core Processor
IBASE Technology, a provider of embedded board and solutions, launches the MI997 Mini-ITX motherboard designed for 12th Gen Intel Core processors (codenamed Alder Lake PS) that supports faster DDR5 memory and takes advantage of a hybrid architecture that combines performance and efficient cores, outperforming previous generations in single-core and multi-core workloads.
Avalue introduces EMX-R680P Mini-ITX flexible expansion motherboard
Avalue will unveil the latest EMX-R680P Mini-ITX motherboard, which features Intel 12th/13th Gen Core i9/i7/i5/i3/Pentium/Celeron processors and supports LGA 1700 CPUs up to 125W.
Three worked examples of potting PCB assemblies
Potting PCB assemblies, which involves filling an enclosure with a liquid material to protect the board and its electrical components, is a common method to protect them.
Gen3 launches latest addition to its e-Book series
Gen3, Global specialist in SIR, CAF, Solderability, Ionic Contamination, and process optimisation equipment, is excited to announce the launch of the latest addition to ‘The Printed Circuit Assembler's Guide to...’ e-Book series in collaboration with i-Connect007.
Mini PCIe 2.5GbE isolated ethernet module for industrial IoT Connectivity
The explosive growth of IoT demands powerful solutions. An interoperable IoT platform is essential to connect and transmit data simultaneously from a vast number of devices.