Boards/Backplanes
Low Cost, Rugged Data Acquisition PCIe MiniCard
Diamond Systems has introduced the DS-MPE-DAQ0804, a rugged, low cost data acquisition PCIe MiniCard module that is ideal for adding analog I/O and digital I/O features to embedded applications requiring low cost, small size, and/or light weight. The DS-MPE-DAQ0804 offers 8 16-bit analog input channels, 4 16-bit analog output channels, and 21 configurable digital I/O lines in a PCIe MiniCard form factor with an extended operating temperature of -...
Double Up Your Security Level With The Acrosser AMB-A55EG1 Gaming Board
The gaming business has never been easy. Most game developers not only need time to find suitable hardware, but also to work on software programming. By time they have finished both, the best time-to-market has already vanished. Acrosser’s AMB-A55EG1 All-in-One gaming board can assist you in building up more security measurements, while also remaining highly flexible for your gaming business.
Axiomtek Announces AMD G-Series Embedded SoC GX-210JA Pico-ITX SBC – PICO121
Axiomtek announces the new arrival of the PICO121, its extremely compact fanless Pico-ITX SBC with ultra-low power AMD G-Series Embedded SoC GX-210JA dual core 1.0GHz onboard. The PICO121 is built to withstand wide temperature conditions, ranging from -20°C to +70°C (-4°F to +158°F). This embedded board supports DirectX 11, Open GL4.2, and Open CL1.2 to provide great graphics performance and features dual-view compatibility throug...
New Data Processing Board Offered By VadaTech Features High Performance and Low Latency
VadaTech now offers a new data processor that meets the MicroTCA.4 specification with a rear I/O interface. The board is ideal for several High Energy Physics applications such as cavity field stabilization and standing-wave linear accelerators, as well as other systems requiring high speeds DSPs and low latency.
First congatec Mini-ITX
congatec AG extends its successful board-level product range with the first industrial Mini-ITX motherboard. The new embedded motherboards will meet the same standards and quality as the established Computer-On-Modules from congatec. Additional services include 7+ years availability, global technical support, extended manuals, specifications and customized design services.
Design kit provides connection to the Internet of Things
A design and development kit that enables developers to securely connect their devices to the cloud from anywhere in the world with an internet connection is available exclusively from Mouser Electronics. The Ayla IoT Design Kit with a Murata Wireless Wi-Fi connectivity module. Developers can use these technologies to provide interactive control of industrial systems, lighting applications, HVAC, and more, all with minimal modifications to existi...
Application board offers extended temperature support
Advantech announces the release of its newest Mini-ITX application board—SOM-AB5810. Featuring pin to pin compatibility with COM Express Basic and Compact type 6 pin-out CPU modules, SOM-AB5810 supports both normal and wide-range temperature demands, as well as a choice of ATX power supply or DC-in 19V adapter. SOM-AB5810 is suited for use in harsh environments.
AdvancedTCA carrier board holds four AMCs
VadaTech has announced an AdvancedTCA (ATCA) carrier board that holds four Advanced Mezzanine Cards (AMCs). Designated the ATC133, this 10GbE Carrier features a 10G managed Layer 2 switch with a Xilinx Virtex-7 FPGA and a Crossbar Switch (CBS) which allows any combination of backplane ports to be routed to the FPGA.
Qseven module targets automotive applications
Powered by the Freescale i.MX6 processor, the FS700 Qseven module has been unveiled by DFI. The module provides excellent multimedia performance due to the combination of the ARM Cortex-A9 architecture with bleeding edge 3D and 2D graphics, as well as high-definition video.
COM uses 4th Gen Intel Core U-series SoC
A COM Express Compact module, designated the HU968, has been launched by DFI. Expanding upon the company's existing Intel Core product line, the U-Series platform has BGA 1168 packaging technology which features smart performance, high speed I/O, and low-power consumption at only 15W TDP. The module's mall form factor of 95mm x 95mm helps save space while providing better connectivity.