Boards/Backplanes
Development kit covers wireless MCU platform options
Farnell element14 has introduced the Texas Instruments’ SimpleLink CC2650 Development Kit, including all the hardware required to evaluate the SimpleLink Wireless MCU ultra-low-power platform. The CC2650 device can also be used to evaluate the SimpleLink Bluetooth Smart CC2640 wireless MCU and the ZigBee/6LoWPAN CC2630 wireless MCU.
Wi-Fi module targets low power IoT applications
The new WINC1500 Wi-Fi Module from Atmel Co is on sale at Mouser Electronics. The module is a low-power consumption 802.11 b/g/n WiFi module specifically optimised for low power Internet of Things (IoT) applications. The WINC1500 WiFi module supports WEP, WPA, and WPA2 WiFi security encryption as well as China WAPI security while drawing as little as 4µA.
Dual FMC features a Xilinx Kintex-7 FPGA
VadaTech now offers a dual FPGA Mezzanine Card (FMC) carrier per the VITA 57 specification. The AMC502 features a Xilinx Kintex-7 FPGA and comes in a double module, mid-size AMC. It has 32MB Flash memory and an on-board crystal referenced clock source to provide at least 125MHz as GTX reference input for PCIe, SRIO and GbE.
Power & board combinations speed up time-to-market
Bicker Elektronik has expanded its Power+Board programme with offerings from two well-known board manufacturers. In addition to Fujitsu's industrial PCBs, bundles with embedded mainboards from ASRock and Perfectron are also available. The three mainboard manufacturers excel through quality, long-term availability and an extended temperature range for industrial applications.
AWP gaming solutions garner interest at ICE 2015
Advantech-Innocore has declared the ICE 2015 tradeshow a ‘huge success’, highlighting elevated interest in its products, especially the DPX-S435, DPX-S1435, DPX-E130 and display products range. Advantech Display Solutions (ADS) is a product division formed when GPEG International joined Advantech last year. ADS offers gaming industry customers specialised monitor and display solutions.
Needles enable the manufacture of PCBs for IoT applications
For bed of nails testing of high density, micro-scale PCBs, ESCATEC has invested in ultra-small needles.This will enable the company to provide customers with next-gen, high density, micro-scale PCBs that are growing in popularity, especially for wearable electronics and IoT applications. Automated bed of nails testing ensures that production costs are kept low for customers and that yields are improved as manual testing with probes is eliminated...
Development board evaluates low power Cortex-M0+ designs
Farnell element14 has launched the new Freescale Kinetis KL27/17 Cortex-M0+ based Freedom Platform with USB. The board is designed to evaluate low power Cortex-M0+ based designs that require USB capability. This new Kinetis FRDM-KL27Z Cortex-M0+ based Freedom Platform with USB OTG features a Flex I/O module, ROM Bootloader and low power crystal-less USB functionality.
Mini-ITX motherboards offer excellent graphics performance
DFI has announced the arrival of HD171-H81 and HD173-H81, two industrial-grade Mini-ITX motherboards powered by the 4th gen Intel Core with Intel H81 chipset. The Intel HD Graphics engine integrated into these 4th gen Intel Core processors provides a seamless visual experience, including superior gaming image quality, vibrant HD video playback, and increased overall speed and performance.
RF module speeds time to market for meter makers
A team formed of EBV Elektronik, WEPTECH elektronik and STMicroelectronics have developed a flexible sub-GHz RF module that streamlines certification of wireless M-BUS and OMS metering systems. The module, called MAIA within the EBVchips program, addresses different metering applications, including automatic meter reading (AMR), advanced metering infrastructure (AMI), gas and water meters, and electricity meters, as well as heat meters or readers...
Directly-solderable module provides performance at low cost
TQ has developed the TQMa335L, a small Minimodule with high processing power which can be directly soldered to the base board. Based on the TI's AM335x processor, the ARM Cortex-A8 module is suitable for device developments where high quality is required at low cost, and is based on LGA technology, whereby connections are placed on the PCB in the form of a chessboard style grid of interfaces.