Boards/Backplanes

Raspberry Pi Design Partner Inelco Hunter has announced the availability of a conveniently pre-assembled Kit Bundle - a Pi 4 Board (4GB) and 10.1" Capacitive Touch Screen Display.

SECO, a pioneer in industrial digitalisation technologies, has announced the launch of its latest COM Express module, incorporating the newly introduced Intel Atom Processors x7000RE Series (Codename: Amston Lake).

Mosaic-X5 compact GNSS* receiver module from Septentrio, a pioneer in high-precision GNSS* positioning solutions, has been integrated into a new Click board by MIKROE, a major provider of solutions for embedded systems development.

The PCB design analysis software’s new update provides valuable Design for assembly insights on PCBA production data that further helps designers reduce problems both during and after assembly.

Today, SiFive unveiled its new state-of-the-art RISC-V development board, the HiFive Premier P550 at embedded world in Nuremberg (April 9-11).

Infineon has announced the XENSIV Sensor Shield for Arduino, a versatile tool designed for evaluating smart sensor systems in smart home and diverse consumer applications.

MIKROE has announced that the company is closely collaborating with Allegro to offer a broad portfolio of products that reduce development efforts and accelerate time to market.

Axiomtek introduces the CEM320, a new addition to its range of COM Express Type 10 modules, featuring optimised processing and graphics performance with low power consumption.

The new VE2302 System-On-Module from Avnet is the first AMD Versal* AI Edge SOM to be added to Avnet’s popular line of SOMs based on the Adaptive SoC family of AMD products.

Arrow Electronics, in collaboration with Infineon Technologies AG, has unveiled a 240W USB Power Delivery (PD) 3.1 reference design board, designed to facilitate high-power applications for customers.